Copper foil for printed circuits and process for producing the s

Details Copper foil for printed circuits and process for producing the s Copper foil for printed circuits and process for producing the s

1993-11-16

1994-11-22

Zimmerman, John

Stock material or miscellaneous articles

All metal or with adjacent metals

Foil or filament smaller than 6 mils

428612, 428675, 428687, 428435, 205111, 205182, 205239, B32B 1520, H05K 109, C25D 706

Patent

active

053668146

ABSTRACT:
A copper foil for printed circuits has a roughened layer formed on the side of the foil to be bonded to a base, the roughened layer consisting of a number of protuberant copper electrodeposits containing chromium tungsten or both. It may also have a copper plating layer covering the roughened layer and a treatment layer covering the copper plating layer and formed of either a metal selected from the group consisting of copper, chromium, nickel, iron, cobalt, and zinc, or an alloy of two or more such metals. When necessary, the copper foil may contain an anticorrosive layer including various chromate treated layers further formed on the treatment layer. The copper foil is produced by electrolyzing a raw foil as a cathode in an acidic copper electrolytic bath at a current density close to the critical density, thereby forming the roughened layer, the electrolytic bath containing 0.001-5 g/l of chromium ion tungsten ion or both. The roughened layer is electrolytically overcoated with the treatment layer following the formation of a copper plating layer, which, when necessary, is anti-corrosively treated.

REFERENCES:
patent: Re30180 (1979-12-01), Wolski et al.
patent: 4619871 (1986-10-01), Takami

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