4. Optics: measuring and testing
  5. By dispersed light spectroscopy
  6. Utilizing a spectrometer

Katsumi Mogi

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Chain cutter

Stone working – Sawing – Endless
Patent

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Cutting apparatus

Stone working – Sawing – Endless
Patent

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Film thickness measuring apparatus, film thickness measuring met

Optics: measuring and testing – By dispersed light spectroscopy – Utilizing a spectrometer
Patent

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Truing apparatus for wafer polishing pad

Abrading – Machine – Combined
Patent

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Profile ID: LFUS-PAI-P-314176

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