Truing apparatus for wafer polishing pad

Details Truing apparatus for wafer polishing pad Truing apparatus for wafer polishing pad

1995-03-20

1996-07-02

Rose, Robert A.

Abrading

Machine

Combined

451443, 451 56, B24B 5300

Patent

active

055316352

ABSTRACT:
A truing apparatus for a wafer polishing pad is provided which is capable of obtaining a sufficient truing effect while keeping the polishing amount of a polishing pad to a maximum. The truing apparatus includes a truing grinding wheel having an abrasive grain layer having ultra-abrasive grains electrodeposited thereon, a support arm for rotatably supporting the truing grinding wheel by bringing the polishing surface of an electrodeposition abrasive grain layer into abutment with the polishing pad, a grinding wheel rotary motor for rotating the grinding wheel, a self-aligning bearing disposed between a grinding wheel support plate and a grinding wheel rotation shaft, and pure water supply means for supplying pure water from the inside of the truing grinding wheel. The outer diameter of the grinding wheel is greater than the outer diameter of the wafers W, and the polishing surface of the grinding wheel is brought into abutment with the polishing pad over the overall width of one circumferential portion of a wafer polishing area. The grain size of the ultra-abrasive grains is preferably set at #60 to #230.

REFERENCES:
patent: 5081051 (1992-01-01), Mattingly
patent: 5216843 (1993-06-01), Breivogel et al.

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