Film thickness measuring apparatus, film thickness measuring met

Optics: measuring and testing – By dispersed light spectroscopy – Utilizing a spectrometer

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

G01B 902

Patent

active

056571232

ABSTRACT:
A light interference-type film thickness measuring mechanism 24 measures a film thickness by irradiating a light emitted from a light transmission portion on to the bottom surface of a wafer W held by a wafer holding head 8 and receives the reflected light and. A cleaning mechanism 26 includes a cleaning fluid tank 27 a top surface of which is opened and arranged in the vicinity of the bottom surface of the wafer; a light transmission portion 50 formed at the bottom portion 48 of the tank 27; a wafer cleaning nozzle 40 spraying the cleaning fluid on the measuring points at the bottom surface of the wafer; a light transmission portion cleaning nozzle 44 spraying the cleaning fluid on the light transmission portion 50 and cleaning fluid supply means for supplying cleaning fluid to these nozzles.

REFERENCES:
patent: 5413941 (1995-05-01), Koos et al.
patent: 5486129 (1996-01-01), Sandhu et al.
patent: 5502564 (1996-03-01), Ledger

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Film thickness measuring apparatus, film thickness measuring met does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Film thickness measuring apparatus, film thickness measuring met, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Film thickness measuring apparatus, film thickness measuring met will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-164031

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.