4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Die bond

Kanto Sanyo Semiconductor Co., Ltd.

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Circuit device

Radiant energy – Ionic separation or analysis – Static field-type ion path-bending selecting means
Reexamination Certificate

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Circuit device

Radiant energy – Ionic separation or analysis – Static field-type ion path-bending selecting means
Reexamination Certificate

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Method for manufacturing circuit devices

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
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Semiconductor device and manufacturing method of the same

Semiconductor device manufacturing: process – Semiconductor substrate dicing
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Semiconductor device with recess portion over pad electrode

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Die bond
Reexamination Certificate

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