Method for manufacturing circuit devices

Details Method for manufacturing circuit devices Method for manufacturing circuit devices

2006-01-24

2006-01-24

Dang, Phuc T. (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

C438S457000, C438S614000

Reexamination Certificate

active

06989291

ABSTRACT:
Priorly, semiconductor devices wherein a flexible sheet with a conductive pattern was employed as a supporting substrate, a semiconductor element was mounted thereon, and the ensemble was molded have been developed. In this case, problems occur that a multilayer wiring structure cannot be formed and warping of the insulating resin sheet in the manufacturing process is prominent. In order to solve these problems, a laminated plate10in which a first conductive film11and a second conductive film12have been laminated via a third conductive film13is used. After forming a conductive pattern layer11A by etching the first conductive film11, anchor portions15are formed by overetching the third conductive film13by use of the conductive pattern layer11A as a mask, and a sealing resin layer22is made to bite into the anchor portions15so as to strengthen bonding of the sealing resin layer22with the conductive pattern layer11A.

REFERENCES:
patent: 4541893 (1985-09-01), Knight
patent: 6146960 (2000-11-01), Chang
patent: 2004/0092129 (2004-05-01), Igarashi et al.
patent: 2004/0097086 (2004-05-01), Igarashi et al.
patent: 2004/0101995 (2004-05-01), Sakai et al.
patent: 2004/0106235 (2004-06-01), Igarashi et al.
patent: 2004/0106288 (2004-06-01), Igarashi et al.

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