4. Cleaning and liquid contact with solids
  5. Processes
  6. Including application of electrical radiant or wave energy...

Kamalesh K. Srivastava

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Control of gas content in process liquids for improved megasonic

Cleaning and liquid contact with solids – Processes – Including application of electrical radiant or wave energy...
Patent

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Flip-chip assembly with organic chip carrier having...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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I/C chip suitable for wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Integrated method for etching of BLM titanium-tungsten...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Low impedance power distribution structure for a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Profile ID: LFUS-PAI-P-460881

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