4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Joyce Hsu

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BGA substrate via structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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BGA substrate via structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
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BGA substrate via structure

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
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Leadframe with elevated small mount pads

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
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System and method for coupling conductive pellets to a...

Metal working – Method of mechanical manufacture – Electrical device making
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Profile ID: LFUS-PAI-P-2047277

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