4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Physical configuration of semiconductor
  6. With electrical contact in hole in semiconductor

Joseph D. Danaher

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Method of polishing C4 molybdenum masks to remove molybdenum...

Etching a substrate: processes – Forming or treating mask used for its nonetching function
Reexamination Certificate

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Semiconductor wafer front side protection

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Semiconductor wafer front side protection

Semiconductor device manufacturing: process – Bonding of plural semiconductor substrates – Thinning of semiconductor substrate
Reexamination Certificate

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Use of photoresist in substrate vias during backside grind

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Use of photoresist in substrate vias during backside grind

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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