4. Electrical generator or motor structure
  5. Non-dynamoelectric
  6. Piezoelectric elements and devices

Jon G. Aday

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Semiconductor module package substrate

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Semiconductor module package substrate fabrication method

Metal fusion bonding – Process – With protecting of work or filler or applying flux
Reexamination Certificate

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Surface acoustic wave device package and method

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Patent

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Profile ID: LFUS-PAI-P-1822294

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