Surface acoustic wave device package and method

Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices

Patent

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Details

310340, 310348, 333193, 29841, 26427211, 174260, 174261, 361760, 361772, 361777, H01L 4108, H03H 925

Patent

active

059694610

ABSTRACT:
A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.

REFERENCES:
patent: 3657610 (1972-04-01), Yamamoto et al.
patent: 4191905 (1980-03-01), Yasuda et al.
patent: 4266156 (1981-05-01), Kizaki
patent: 4405875 (1983-09-01), Nagai
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4661192 (1987-04-01), McShane
patent: 4699682 (1987-10-01), Takishima
patent: 4734608 (1988-03-01), Takoshima et al.
patent: 4736128 (1988-04-01), Takoshima et al.
patent: 4737742 (1988-04-01), Takoshima et al.
patent: 4864470 (1989-09-01), Nishio
patent: 4993000 (1991-02-01), Niitsuma et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5095240 (1992-03-01), Nysen et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5252882 (1993-10-01), Yatsuda
patent: 5281883 (1994-01-01), Ikata et al.
patent: 5359494 (1994-10-01), Moritomo
patent: 5390401 (1995-02-01), Shikata et al.
patent: 5438305 (1995-08-01), Hikita et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5471722 (1995-12-01), Yatsuda
patent: 5504980 (1996-04-01), Yoshinaga et al.
patent: 5900581 (1999-05-01), Ootake

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