Electrical generator or motor structure – Non-dynamoelectric – Piezoelectric elements and devices
Patent
1998-04-08
1999-10-19
Picard, Leo P.
Electrical generator or motor structure
Non-dynamoelectric
Piezoelectric elements and devices
310340, 310348, 333193, 29841, 26427211, 174260, 174261, 361760, 361772, 361777, H01L 4108, H03H 925
Patent
active
059694610
ABSTRACT:
A method for packaging an acoustic wave device (10) without contaminating an active area (12) disposed on a face (14) thereof, including steps of: providing a substrate with a top (30) having conductive pads (18), bonding stud bumps (20) to a periphery (22) of the face (14) of the acoustic wave device, disposing a dam (26) onto the top (30) of the substrate and inside of the location of the conductive pads (18), aligning and connecting the stud bumps (20) to the conductive pads (18) on the top of the substrate to form electrically conductive interconnections between the acoustic wave device (10) and the substrate (16), flowing an underfill material (28) at the periphery (22) of the acoustic wave device and around the interconnections such that the underfill material (28) stops at a boundary (32) defined by the dam (26), and curing the underfill material (28) to mechanically reinforce and protectively encapsulate the interconnections.
REFERENCES:
patent: 3657610 (1972-04-01), Yamamoto et al.
patent: 4191905 (1980-03-01), Yasuda et al.
patent: 4266156 (1981-05-01), Kizaki
patent: 4405875 (1983-09-01), Nagai
patent: 4604644 (1986-08-01), Beckham et al.
patent: 4661192 (1987-04-01), McShane
patent: 4699682 (1987-10-01), Takishima
patent: 4734608 (1988-03-01), Takoshima et al.
patent: 4736128 (1988-04-01), Takoshima et al.
patent: 4737742 (1988-04-01), Takoshima et al.
patent: 4864470 (1989-09-01), Nishio
patent: 4993000 (1991-02-01), Niitsuma et al.
patent: 5014111 (1991-05-01), Tsuda et al.
patent: 5090119 (1992-02-01), Tsuda et al.
patent: 5095240 (1992-03-01), Nysen et al.
patent: 5120678 (1992-06-01), Moore et al.
patent: 5252882 (1993-10-01), Yatsuda
patent: 5281883 (1994-01-01), Ikata et al.
patent: 5359494 (1994-10-01), Moritomo
patent: 5390401 (1995-02-01), Shikata et al.
patent: 5438305 (1995-08-01), Hikita et al.
patent: 5459368 (1995-10-01), Onishi et al.
patent: 5471722 (1995-12-01), Yatsuda
patent: 5504980 (1996-04-01), Yoshinaga et al.
patent: 5900581 (1999-05-01), Ootake
Aday Jon G.
Anderson Michael J.
Christensen Jeffrey E.
Johnson Gary C.
Kennison Gregory
CTS Corporation
Picard Leo P.
Vigushin John B.
LandOfFree
Surface acoustic wave device package and method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Surface acoustic wave device package and method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Surface acoustic wave device package and method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-2060141