Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent
1998-01-22
2000-05-09
Picard, Leo P.
Electricity: electrical systems and devices
Housing or mounting assemblies with diverse electrical...
For electronic systems and devices
361690, 361694, 361753, 361760, 361772, 361776, 361777, 361803, 174254, 439 67, 439 77, H05K 111, H05K 114
Patent
active
060612452
ABSTRACT:
An efficient cooling mechanism for a multi-chip carrier can be provided while conserving board surface area. Flexible circuitized material is used to form multi-chip carriers with air baffle capability. The flex is folded or curved into the desired shape and held in position with a support structure. Bonding sites for chips are located on regions through the carrier. Shapes which provide air baffle capabilities include coils, spring-like coils and serpentines.
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Ingraham Anthony P.
Kehley Glenn L.
Sathe Sanjeev B.
Slack John R.
International Business Machines - Corporation
Picard Leo P.
Vigushin John B.
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