Aluminum leadframes for semiconductor devices and method of...

Details Aluminum leadframes for semiconductor devices and method of... Aluminum leadframes for semiconductor devices and method of...

2005-08-23

2005-08-23

Nguyen, Ha Tran (Department: 2812)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Metallic housing or support

C438S209000, C438S121000, C438S111000

Reexamination Certificate

active

06933177

ABSTRACT:
A leadframe for use with integrated circuit chips comprising a leadframe base made of aluminum or aluminum alloy having a surface layer of zinc; a first layer of nickel on said zinc layer, said first nickel layer deposited to be compatible with aluminum and zinc; a layer of an alloy of nickel and a noble metal on said first nickel layer; a second layer of nickel on said alloy layer, said second nickel layer deposited to be suitable for lead bending and solder attachment; and an outermost layer of noble metal, whereby said leadframe is suitable for solder attachment to other parts, for wire bonding, and for corrosion protection.

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