Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
Inventor
active
Chip interconnect wiring structure with low dielectric...
Chip interconnect wiring structure with low dielectric...
Dual damascene flowable oxide insulation structure and...
Dual damascene flowable oxide insulation structure and...
Encapsulation of conductive lines of semiconductor devices
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John P. Hummel has received 1 rating(s) and 1 review(s), resulting in an average rating of 4.60 on a scale from 1 to 5. The overall rating for this inventor is excellent.
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N.B.
A brilliant man that has contributed much to the technological community.
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Profile ID: LFUS-PAI-P-1958417