4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

John Guzek

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active

Metal core integrated circuit package with electrically...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Method of providing mixed size solder bumps on a substrate...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of providing solder bumps of mixed sizes on a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2854256

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