High frequency microelectronic circuit enclosure

Details High frequency microelectronic circuit enclosure High frequency microelectronic circuit enclosure

1995-05-22

1996-07-30

Gensler, Paul

Wave transmission lines and networks

Coupling networks

With impedance matching

257664, 257666, 333246, H01P 502, H01L 23495

Patent

active

055415652

ABSTRACT:
An enclosure assembly for a high frequency integrated circuit. The enclosure assembly includes a plurality of lead terminals that are part of a lead frame. The lead terminals are connected to electrical ports of the circuit within the enclosure to connect the circuit to other integrated circuits and/or to a printed circuit board. A portion of the lead terminals outside of the enclosure has a specially shaped flared region that establishes the characteristic impedance of the circuit on the lead lines outside of the enclosure.

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