4. Abrading
  5. Abrading process
  6. With critical nonabrading work treating

Johann Winderl

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Apparatus for applying a semiconductor chip to a carrier...

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated – With specified encapsulant
Reexamination Certificate

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Chip carrier having ventilation channels

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – On insulating carrier other than a printed circuit board
Reexamination Certificate

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Device for packaging electronic components

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Electronic component with a semiconductor chip and method of...

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate

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Electronic component with stacked semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2499586

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