Electronic component with stacked semiconductor chips

Details Electronic component with stacked semiconductor chips Electronic component with stacked semiconductor chips

2005-05-17

2005-05-17

Thai, Luan (Department: 2829)

Active solid-state devices (e.g., transistors, solid-state diode

Housing or package

Multiple housings

C257S774000, C257S737000, C257S738000, C257S779000, C257S780000

Reexamination Certificate

active

06894378

ABSTRACT:
An electronic component with at least two stacked semiconductor chips is described. The chips are respectively mounted on a wiring board. The wiring boards are stacked one on top of the other and interconnected mechanically and electrically by soldered connections. The soldered connections extend through apertures in the wiring boards and over one or more levels of wiring boards stacked one on top of the other, with semiconductor chips mounted on these boards. A method for producing the electronic component is also described.

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patent: 04 030 561 (1992-02-01), None

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