Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With peripheral feature due to separation of smaller...
Reexamination Certificate
2005-05-10
2005-05-10
Munson, Gene M. (Department: 2811)
Active solid-state devices (e.g., transistors, solid-state diode
Physical configuration of semiconductor
With peripheral feature due to separation of smaller...
C257S618000
Reexamination Certificate
active
06891252
ABSTRACT:
An electronic component includes a semiconductor chip which has an active upper side and a passive rear side. The semiconductor chip is surrounded by a sawn edge. This edge of semiconductor material has profile-sawn contours. The profile-sawn contours are surrounded by a plastics composition forming an edge of plastic. The plastics composition is in form-locking engagement with the profile-sawn contours. A method of producing a component of this type is also provided.
REFERENCES:
patent: 5583370 (1996-12-01), Higgins et al.
patent: 5879964 (1999-03-01), Paik et al.
patent: 5883439 (1999-03-01), Saitoh
patent: 6043109 (2000-03-01), Yang et al.
patent: 6043564 (2000-03-01), Brooks et al.
patent: 6051875 (2000-04-01), Dando
patent: 37 20 465 (1988-12-01), None
patent: 43 33 407 (1994-11-01), None
patent: 195 00 655 (1996-07-01), None
patent: 196 36 112 (1998-03-01), None
patent: 0 980 096 (2000-02-01), None
patent: 02 144 946 (1990-06-01), None
patent: 08 031 989 (1996-02-01), None
Neumayer Martin
Winderl Johann
Greenberg Laurence A.
Infineon - Technologies AG
Mayback Gregory L.
Munson Gene M.
Stemer Werner H.
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