Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
With contact or metallization configuration to reduce...
Inventor
active
Apparatus for integration of barrier layer and seed layer
Integration of ALD tantalum nitride for copper metallization
Integration of barrier layer and seed layer
Integration of barrier layer and seed layer
Integration of barrier layer and seed layer
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Profile ID: LFUS-PAI-P-2388278