Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate
2005-08-30
2005-08-30
Wilczewski, Mary (Department: 2822)
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
With provision for cooling the housing or its contents
C257S706000, C257S707000, C257S712000
Reexamination Certificate
active
06936919
ABSTRACT:
A packaged integrated circuit that includes a substrate310; a chip300mounted on the substrate; and a heatsink350mounted on the chip. The heatsink has a spacer360attached to one of its surfaces to provide a standoff distance between the heatsink and the substrate. The substrate and the heatsink can include moats into which the spacer is adapted to fit. The moat can be a notch at the edge of the substrate or it can be a channel or depression in the substrate surface. The spacer can be made of a high-modulus or low-modulus material, or a combination of the two.
REFERENCES:
patent: 4637456 (1987-01-01), Niggemann
patent: 5311402 (1994-05-01), Kobayashi et al.
patent: 5396403 (1995-03-01), Patel
patent: 5810607 (1998-09-01), Shih et al.
patent: 5889323 (1999-03-01), Tachibana
patent: 5907474 (1999-05-01), Dolbear
patent: 5909056 (1999-06-01), Mertol
patent: 6008536 (1999-12-01), Mertol
patent: 6011304 (2000-01-01), Mertol
patent: 6212070 (2001-04-01), Atwood et al.
patent: 6212074 (2001-04-01), Gonsalves et al.
patent: 6218730 (2001-04-01), Toy et al.
patent: 6282096 (2001-08-01), Lo et al.
patent: 6413353 (2002-07-01), Pompeo et al.
patent: 6515360 (2003-02-01), Matsushima et al.
patent: 6528876 (2003-03-01), Huang
patent: 6730993 (2004-05-01), Boyer et al.
patent: 2002/0125564 (2002-09-01), Shibata
patent: 2003/0209465 (2003-11-01), Shoji
patent: 404225263 (1992-08-01), None
patent: 06334075 (1993-05-01), None
Zitz et al., “Direct Lid Attach Packaging for Ceramic Chip-Carrier Applications,” MicroNews Second Quarter 1999, vol. 5, No. 2.
Chuang Shih-Fang
Libres Jeremias P.
Brady III Wade James
Lewis Monica
Tung Yingsheng
Wilczewski Mary
LandOfFree
Heatsink-substrate-spacer structure for an... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Heatsink-substrate-spacer structure for an..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Heatsink-substrate-spacer structure for an... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3485812