4. Coating processes
  5. Direct application of electrical, magnetic, wave, or...
  6. Pretreatment of substrate or post-treatment of coated substrate

Jennifer Meng Chu Tseng

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Purge in silicide deposition processes dichlorosilane

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Wafer surface temperature control for deposition of thin films

Coating processes – Direct application of electrical – magnetic – wave – or... – Pretreatment of substrate or post-treatment of coated substrate
Patent

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Profile ID: LFUS-PAI-P-1513960

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