4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Jeffrey Lien

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active

Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Concealable chip leadframe unit structure

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Manufacturing method of a modularized leadframe

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Packaging method for integrated circuits

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2940065

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