Flip chip metallization

Details Flip chip metallization Flip chip metallization

1998-10-14

2000-10-10

Picardat, Kevin M.

Semiconductor device manufacturing: process

Bonding of plural semiconductor substrates

438456, 438458, H01L 2130, H01L 2146

Patent

active

061301418

ABSTRACT:
The specification describes techniques for applying under bump metallization (UBM) for solder bump interconnections on IC chips with Al bonding sites. The UBM of the invention comprises a copper layer applied directly to the aluminum bonding sites. Reliable bonds are obtained if the Al surface is a nascent surface. Such a surface can be provided by back sputtering an aluminum bonding site, or by a freshly sputtered aluminum layer. The copper layer is deposited on the nascent aluminum surface in e.g. a cluster tool without breaking vacuum. The UBM can be patterned using subtractive techniques.

REFERENCES:
patent: 5773359 (1998-06-01), Mitchell et al.
patent: 5904859 (1999-05-01), Degani
patent: 5985694 (1999-11-01), Cho

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