4. Metal working
  5. Method of mechanical manufacture
  6. Electrical device making

Janet E. Poetzinger

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Method for replacing IC chip package interposer

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Method of fabricating a multi-layer integrated circuit chip inte

Metal working – Method of mechanical manufacture – Electrical device making
Patent

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Parallel process interposer (PPI)

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Profile ID: LFUS-PAI-P-1232808

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