Method of fabricating a multi-layer integrated circuit chip inte

Details Method of fabricating a multi-layer integrated circuit chip inte Method of fabricating a multi-layer integrated circuit chip inte

1993-11-17

1995-02-07

Vo, Peter Dungba

Metal working

Method of mechanical manufacture

Electrical device making

29830, 156902, H05K 346, H05K 342

Patent

active

053866274

ABSTRACT:
A multilayer, high yield and high density integrated circuit (IC) chips interposer and the method of manufacture therefore. A thin polyimide film is circuitized with copper on both sides. One side may be reserved for power or ground with the opposite side being a signal plane. Adhesive is laminated over both sides covering the circuit patterns. Vias are drilled through at least one adhesive surface, and through the polyimide film. Metal (copper) is blanket sputtered to coat the via walls. Polymer Metal Conductive (PMC) paste is screened to at least partially fill the vias. The Blanket metal is sub-etched using the screened PMC as a mask. Layers are stacked to form the interposer with the PMC bonding the stacked layers together and electrically interconnecting between layers.

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