Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1982-01-18
1983-02-22
Smith, John D.
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
118505, 427272, 1566611, 156656, 156664, 156901, H05K 340
Patent
active
043748694
ABSTRACT:
A method of forming a flexible printed wiring board having a metal substrate includes the steps of etching through-holes in the metal substrate by means of an etch resistant ferro electric mask placed over the substrate and employing a viscous sealant such as polyethylene or polypropylene glycol between the mask and the substrate. The mask is held to the substrate with the sealant therebetween by means of a magnetic field. The substrate is then treated with a ferric chloride etch solution to etch away the desired through-holes in the metal substrate. Thereafter, the substrate may be coated with a polymeric coated by means of fluidized bed or electrostatic coating techniques as taught in the prior art.
REFERENCES:
patent: 2453582 (1948-11-01), Morgan
patent: 3002847 (1961-10-01), Shaffer et al.
patent: 3170810 (1965-02-01), Kagan
patent: 3650860 (1972-03-01), Rolker, Jr.
patent: 3841261 (1974-10-01), Hudson et al.
patent: 4159222 (1979-06-01), Lebow et al.
patent: 4247361 (1981-01-01), Shaheen
"High-Speed Circuit Etch for the Precision Etching of Copper Laminates", Philip A. Hunt Chem. Corp. Tech. Bulletin, No. 12, Aug. 23, 1976.
"Spray Masking System", W. J. Tesche, Western Electric Technical Digest No. 22, Apr. 1971.
Dorey II John K.
Huneke James T.
Plantz Bernard F.
Smith John D.
Spivak Joel F.
Western Electric Company Inc.
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