4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

James L. Carper

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Leadframe having contact pads defined by a polymer insulating fi

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Leadframe having contact pads defined by a polymer insulating fi

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Planarized plastic package modules for integrated circuits

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1309667

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