4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

James Forster

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Clad metal substrate

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Package for integrated circuits

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Probe card with contact apparatus and method of manufacture

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Semiconductor test structure having a laser defined current...

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1213113

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