4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Assembly of plural semiconductive substrates each possessing...

Ivor G. Barber

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Method of flip chip assembly

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Patent

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Method of packaging an integrated circuit

Fishing – trapping – and vermin destroying
Patent

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Method of packaging integrated circuits

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Patent

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Thermal and mechanical attachment of a heatspreader to a...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Flip chip
Reexamination Certificate

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Thermal and mechanical attachment of a heatspreader to a...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-466364

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