Method of flip chip assembly

Details Method of flip chip assembly Method of flip chip assembly

1996-03-14

1998-03-03

Niebling, John

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

438108, 438127, H01L 2144, H01L 2148

Patent

active

057233691

ABSTRACT:
To assemble a flip chip in a package, the back of the flip chip is coated with a heat conductive material and a heat conductive substrate is attached to the heat conductive material. Solder bumps are attached to the front of the flip chip and to a package substrate to mount the flip chip on the package, leaving a space between the flip chip and the package substrate. The space between the flip chip and the package substrate is under filled with a heat conductive media, and the flip chip is encapsulated against the package substrate with a peripheral mold such that at least a portion of the conductive substrate remains exposed. A final package is formed by electrical connectors attached to the package substrate.

REFERENCES:
patent: 5120665 (1992-06-01), Tsukagoshi et al.
patent: 5409865 (1995-04-01), Karnezos
patent: 5450283 (1995-09-01), Lin et al.
patent: 5490324 (1996-02-01), Newmann
patent: 5519936 (1996-05-01), Andros et al.
patent: 5578525 (1996-11-01), Mizukoshi
Tummala et al, "Microelectronics Packaging Handbook", Van Nostrand Reinhold, pp. 363-373, 443-445, 1989.

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