4. Stock material or miscellaneous articles
  5. All metal or with adjacent metals
  6. Laterally noncoextensive components

Itsuroh Shishido

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Bonding material and bump

Stock material or miscellaneous articles – All metal or with adjacent metals – Laterally noncoextensive components
Reexamination Certificate

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Electronic package with bonded structure and method of making

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Portion of housing of specific materials
Reexamination Certificate

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Electronic package with bonded structure and method of making

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2062107

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