4. Metal fusion bonding
  5. Process
  6. Plural joints

Inderjit Singh

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Bond pad sealing using wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
Reexamination Certificate

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Bonding wire inductor for use in an integrated circuit package a

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent

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Compounds for reducing ischemia/reperfusion injury

Drug – bio-affecting and body treating compositions – Inorganic active ingredient containing – Hydrogen metal cyanide – cyanide – cyanate – or thio analog...
Patent

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Encapsulated ball bonding apparatus and method

Metal fusion bonding – Process – Plural joints
Patent

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Flip chip with solder pre-plated leadframe including...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Reexamination Certificate

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Profile ID: LFUS-PAI-P-512094

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