Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Patent
1997-11-07
1999-03-23
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
257691, 257784, 257713, 257679, 235491, 235492, 342 50, H01L 2348, H01Q 1270
Patent
active
058863931
ABSTRACT:
An integrated circuit package assembly is disclosed herein and includes at least one integrated circuit chip having a plurality of chip input/output terminals, an arrangement for providing electrical communication between said input/output terminals and components external to said package, and an electrical inductor arrangement. The electrical inductor arrangement includes an origination terminal, a termination terminal, at least one intermediate connecting surface and a bonding wire positioned within the package. A first segment of the bonding wire is electrically connected with the origination terminal and a second segment is electrically connected with the termination terminal. Furthermore, the bonding wire has at least one intermediate point along it's length physically connected with one intermediate connecting surface. In one embodiment, the bonding wire is continuous along its length. At least two of the bonding wire segments extend in general directions which are non-collinear with respect to one another such that the continuous bonding wire can be electrically energized so as to function as an inductive loop.
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Merrill et al., "Optimization of High Q Integrated Inductors for Multi-Level Metal CMOS." IEDM 95 pp. 983-986.
Jan Craninckx and Michel S.J. Steyaert, "A 1.8 GHz CMOS Low-Phase-Noise Voltage-Controlled Oscillator with Prescaler." IEEE Journal of Solid-State Circuits, vol. 30, No. 12, Dec. 1995, pp. 1474-1482.
Merrill Richard Billings
Singh Inderjit
Brown Peter Toby
Duong Hung Van
National Semiconductor Corporation
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