4. Semiconductor device manufacturing: process
  5. With measuring or testing
  6. Packaging or treatment of packaged semiconductor

In Ho Hyun

Inventor

Rate now
  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

Inventor

active

Method for manufacturing known good die array having solder bump

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Test socket and method for producing known good dies using the t

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

  [ 0.00 ] – not rated yet Voters 0   Comments 0

No associations

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

In Ho Hyun does not yet have a rating. At this time, there are no reviews or comments for this inventor.

If you have personal experience with In Ho Hyun, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and In Ho Hyun will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-P-535786

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.

Canada

 Charities
 Companies
 MP Candidates
 Patents
 Employee Salary Disclosure

World

 Places of the World
 Scientific Papers

United States

 Banks
 Companies
 Counties
 Patents
 Employee Salary Disclosure