4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

Imphy S.A. (Societe Anonyme)

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Connection leads for an electronic component

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Encapsulated electronic component having a plurality of connecti

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Patent

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Profile ID: LFUS-PAI-P-1316150

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