4. Metal treatment
  5. Compositions
  6. Heat treating

Ichiroh Sawamura

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Electrolytic copper plating method, phosphorous copper anode...

Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate

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Method of producing Ti alloy plates

Metal treatment – Compositions – Heat treating
Patent

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Sputtering target assembly having solid-phase bonded interface

Chemistry: electrical and wave energy – Apparatus – Coating – forming or etching by sputtering
Patent

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Profile ID: LFUS-PAI-P-935877

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