4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead

Hyae-ryoung Lee

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Integrated circuit bonding pads including closed vias and...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Of specified material other than unalloyed aluminum
Reexamination Certificate

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Integrated circuit bonding pads including conductive layers...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Integrated circuit bonding pads including intermediate closed co

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead
Patent

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Method of forming integrated circuit capacitors having...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Methods of fabricating integrated circuit bonding pads...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-471003

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