Adhesive bonding and miscellaneous chemical manufacture
Surface bonding means and/or assembly means therefor
With means applying wave energy or electrical energy...
Inventor
active
Apparatus for attaching heat sinks directly to chip carrier modu
Chip carrier modules with heat sinks attached by flexible-epoxy
Method for attaching heat sinks directly to chip carrier modules
Method for making single layer leadframe having groundplane capa
Removable thermocouple template for monitoring temperature of mu
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Profile ID: LFUS-PAI-P-51665