Method for making single layer leadframe having groundplane capa

Details Method for making single layer leadframe having groundplane capa Method for making single layer leadframe having groundplane capa

1995-06-07

1997-06-17

Niebling, John

Fishing, trapping, and vermin destroying

437206, 437217, 437220, H01L 2160

Patent

active

056396945

ABSTRACT:
A method of making an electronic package including providing a leadframe of a single layer of material. The leadframe includes a semiconductor device support, a plurality of signal leads, and a common ground portion surrounding the device support portion. A semiconductor device having a plurality of signal sites and a plurality of ground sites is positioned on the semiconductor device support of the leadframe. Selected ones of the signal sites are connected to respective ones of the signal leads. Selective ones of the ground sites are connected to the common ground portion of the leadframe. Each of the signal leads are electrically isolated from each other and from the common ground portion of the leadframe.

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