4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Lead frame
  6. Of specified material other than copper

Hung-Ming Wang

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Efficient wafer processing technology

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Graded metallic leads for connection to microelectronic...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Graded metallic leads for connection to microelectronic...

Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Reexamination Certificate

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Layered lead structures

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – Of specified material other than copper
Reexamination Certificate

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Metal-jacketed lead manufacturing process using resist layers

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Profile ID: LFUS-PAI-P-2036568

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