Efficient wafer processing technology

Details Efficient wafer processing technology Efficient wafer processing technology

2007-08-21

2007-08-21

Arbes, Carl J. (Department: 3729)

Metal working

Method of mechanical manufacture

Electrical device making

C029S846000, C205S222000, C438S584000, C438S637000, C438S678000, C438S687000

Reexamination Certificate

active

11447368

ABSTRACT:
Consistent excess conductive material is provided for plated conductors in integrated circuit metallization, regardless of the size and depth of trenches/vias into which the conductive material is deposited. Accordingly, subsequent processing (e.g., material removal) can be consistent and efficient for wafers with different feature sizes (particularly different depths), and for wafers at different metallization levels.

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