Hugh L. Garvin

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3-D integrated circuit assembly employing discrete chips

Electricity: electrical systems and devices – Safety and protection of systems and devices – With specific current responsive fault sensor
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High selectivity thin film polarizer

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
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Inducing tilted perpendicular alignment in liquid crystals

Chemistry: electrical and wave energy – Processes and products – Coating – forming or etching by sputtering
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Inducing tilted perpendicular alignment in liquid crystals

Stock material or miscellaneous articles – Liquid crystal optical display having layer of specified... – With charge transferring layer of specified composition
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Ion beam micromachining method

Electric heating – Metal heating – By arc
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Profile ID: LFUS-PAI-P-187127

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