4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Hua Wen Chiang

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Method of forming bumps on wafers or substrates

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method of forming cylindrical bumps on a substrate for...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Process of manufacturing thin ball grid array substrates

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2089316

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