Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
Insulating material
Inventor
active
Built-in stress pattern on IC dies and method of forming
Electronic substrate having an aperture position through a...
Flip-chip ball grid array package with a heat slug
Simultaneous bumping/bonding process utilizing edge-type...
Wafer level package incorporating dual compliant layers and...
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Profile ID: LFUS-PAI-P-1161227