4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Test or calibration structure

Hsiang-Ming Huang

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High frequency IC package and method for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Method for fabricating a plurality of elastic probes in a row

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Method for fabricating a plurality of elastic probes in a row

Metal working – Method of mechanical manufacture – Electrical device making
Reexamination Certificate

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Modular probe card

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Modular probe card

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2170755

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