4. Adhesive bonding and miscellaneous chemical manufacture
  5. Delaminating processes adapted for specified product
  6. Delaminating in preparation for post processing recycling step

Hongzong Chew

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Linewidth control apparatus and method

Semiconductor device manufacturing: process – Including control responsive to sensed condition – Electrical characteristic sensed
Patent

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Method of taper-etching with photoresist adhesion layer

Adhesive bonding and miscellaneous chemical manufacture – Delaminating processes adapted for specified product – Delaminating in preparation for post processing recycling step
Patent

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Vertical replacement gate (VRG) MOSFET with a conductive...

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1153343

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