Conductive layers and fabrication methods thereof

Details Conductive layers and fabrication methods thereof Conductive layers and fabrication methods thereof

2006-10-25

2010-10-26

Dang, Phuc T (Department: 2892)

Active solid-state devices (e.g., transistors, solid-state diode

Combined with electrical contact or lead

Of specified material other than unalloyed aluminum

C257S759000, C257S760000, C438S584000, C438S590000

Reexamination Certificate

active

07821136

ABSTRACT:
Methods for forming conductive layers. A layer of metal composite is applied on a substrate, comprising a plurality of metal flakes, a plurality of nanometer metal spheres, and a plurality of mixed metal precursors. The plurality of mixed metal precursors comprises a mixture of inorganic salts and organic acidic salts. The layer of metal composite is cured to induce an exothermic reaction, thereby forming a conductive layer on the substrate at a relatively low temperature (<200° C.).

REFERENCES:
patent: 6036889 (2000-03-01), Kydd
patent: 6440607 (2002-08-01), Harada et al.
patent: 2003/0124259 (2003-07-01), Kodas et al.
patent: 2003/0155023 (2003-08-01), Miyazawa et al.
patent: WO9943728 (1999-09-01), None

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