4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Configuration or pattern of bonds

Hong-beom Kim

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Bonding pad in semiconductor device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Configuration or pattern of bonds
Patent

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Integrated circuit apparatus having improved test circuit...

Error detection/correction and fault detection/recovery – Pulse or data error handling – Digital logic testing
Reexamination Certificate

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Voltage clamping circuit for semiconductor devices

Miscellaneous active electrical nonlinear devices – circuits – and – Signal converting – shaping – or generating – Amplitude control
Patent

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Profile ID: LFUS-PAI-P-1366387

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