4. Metal working
  5. Barrier layer or semiconductor device making

Hitoshi Fukaya

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Apparatus for continuous assembly of a semiconductor lead frame

Metal working – Barrier layer or semiconductor device making
Patent

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Lead frame with increased strength and manufacture of semiconduc

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Lead frame with increased strength and manufacture of semiconduc

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Profile ID: LFUS-PAI-P-445743

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